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September 2001

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Subject:
From:
Eric Christison <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 27 Sep 2001 03:20:30 -0500
Content-Type:
text/plain
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text/plain (75 lines)
Steve,

The thermal path between PCB I/O's etc would be very poor. The temperature
sensitive part of the device are not electrically connected to the rest of
the device. Therefore I think air temperature above the board would the most
important factor in the problem.

Regards,



> Eric,
>
> Wouldn't the temperature which your parts experience also be a function
>  of
> the thermal path of the device's leads - eg - thick robust copper leads
> (TO-220 like) conducting more heat than thin small leads?
>
> Steve Creswick
>
> -----Original Message-----
> From: Eric Christison [mailto:[log in to unmask]]
> Sent: Wednesday, September 26, 2001 8:38 AM
> To: [log in to unmask]
> Subject: [TN] Wave soldering Questions
>
>
> I've got a question on wave soldering.
>
> We have a temperature sensitive component that we need to connect to a
>  PCB.
> We know the component won't survive reflow temperatures but we could
> redesign the package so that it is suitable for wave soldering. The
> temperature sensitive part of the device is several mm above the PCB.
>
> What sort of temperature profile could one expect say 5mm above the PCB?
>
> Is wave soldering a technique which is still in common use or would
>  finding
> a wavesoldering subcontractor or equipment be like looking for someone
>  to
> service my Model 'T' Ford?
>
> Are there (or will there be) any issues about wave soldering with lead
>  free
> solder?
>
> Regards,
>
>
>
>
> Eric Christison
> Mechanical Engineer
> STMicrolectronics
> 33 Pinkhill
> Edinburgh
> EH12 7BF UK
>
> Tel 44 (0) 131 336 6165
> Fax 44 (0) 131 336 6001


Eric Christison

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