TECHNET Archives

October 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Outer layer annular ring capability
From:
"Joy, Stephen C" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Oct 1999 07:40:59 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
What is the capability for drilling a .0135" or so hole in a pad? Assuming
tangency, how good is registration for a standard pc motherboard form
factor? Is automated better than eye aligned? Is solder mask the same as
outer layers in terms of registration?
Thanks,
Steve

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2