I know what they mean and define it as thus:

Solder (unless dammed) will (typically) run along the trace.

In the case of a BGA field the pad placement typically has a via connected
very close to it in the shape of a dog bone.

This allows solder ( unless dammed) to run into the via which is typically
very small. 

The via will tend to pull virtually all of the solder from the joint, as the
solder wets to the internal surfaces of the via and tries to fill the via
hole.

So I am not sure where the term Skived comes from but I believe I have
accurately described the mechanism to which it is applied.

Incidentally, the barrier does not have to be a classic solder resist. I
have successfully used a temporary screen printed water soluble mask for use
in RF equipment back in the late '80's. I have also used a laser to define
pad edges where a design engineer had accidentally used enig on a flip chip
design without a mask in the late '90's. In this case the laser ablated the
top gold surface as a stripe leaving the nickel exposed, and the solder
would not run back past that point.

Kind regards,

John

 
 
John Burke
 
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: Thursday, May 08, 2008 10:34 AM
To: [log in to unmask]
Subject: [TN] The meaning of "skived"

Can anyone define "skived" as in:
IPC-A-600      2.9.3.3   Ball Grid Array (Solder Dam)

"....in order to avoid solder being skived from the attachment joint
into the via."

Online dictionaries define skive as:	to slice off (leather, rubber,
etc.) in thin layers; shave.

It sort of gives me an idea, but it really isn't very clear.
Thanks in advance.

Genny 

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