Hi Ingemar,

The Wassink book sounds interesting - who are the publishers?

Regards
Grant
Cape Town, South Africa

-----Original Message-----
From: [log in to unmask]
[mailto:[log in to unmask]]
Sent: Wednesday, August 11, 1999 3:12 PM
To: [log in to unmask]
Subject: [TN] Solderability


Deepak,
seems as you have a direct-radiating IR-oven and too long exposure. What
if you use an ordinary convection heat oven and just one minute exposure
?(maybe your board mass does not fit that short time). Many factors that
you don't mention: solder mask? pin finish? flux preactivating? etc... I
use Klein Wassink's book 'Soldering in Electronics' for trouble
shooting. Recommend you to buy it even if you will get grand solutions
these minutes from the often-seen-and-blessed-be-gurus in this
forum./regards/Ingemar


> Hello Technetters,
>
> We are doing a job of soldering around 4500 pins into a Glass Epoxy
> Multilayer PCB of size 288 x 200 mm. The pins are first push fit into
the
> PCB . The pins protrude on both sides of the PCB . On once side the
pins
> will mate with a connector, and on the other side wires are wrapped
on. 1
> Solder ring ( 0.9 mm dia ) is then put over each pin . The board is
then put
> in a reflow over for 180 sec at 235 deg C. We find that the solder
joint are
> not properly formed, and the finish is quite dull. The solder ring is
> composed of 62% Tin, 2 % Silver, 34 % Lead. The solder flows out to
the
> other side of the PCB , but is not quite enough. We also notice
> discoloration of the PCB after this cycle.
>
> What are the issues  that we need to be looking at here, to get a
better
> joint with a better finish . We are completely new to this .
>
> Appreciate some inputs and tips on doing this
>
> With warm regards
>
> Deepak Kuriyan
> Framatome Connectors OEN
>
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