TECHNET Archives

November 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Wildes, Earl" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Nov 2001 10:36:06 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
Greetings.
I am looking for a procedure or training material on proper handling of
surface mount components.  We often have short production runs, so sending
the whole reel/tray to the line is not an option.  We need to show the
stockroom that you don't put a fine pitch IC in a static bag and drop it on
the shelf.
I found lots of info on assembly, soldering and rework, along with ESD and
moisture requirements, but nothing about the physical handling of the parts.
I could write one, but I'm sure someone has already done a much better job.

Thanks.


Earl Wildes
Sr. Component Engineer
Korry Electronics Co.
901 Dexter Ave N.
Seattle, WA  98109
206-694-1398
[log in to unmask]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2