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October 1999

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Subject:
From:
Jan Thuesen <[log in to unmask]>
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Date:
Thu, 7 Oct 1999 12:54:12 +0200
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Dear Green,
I blieve the increase in solder contamination would depend of how much
solder you drag out with the panels as copper coming in would be relative
constantly.
So the raise of copper-contamination cuold be PCB-design dependent or one
operator blowing less solder from the panels ?

Alternative interferens from precleaning raising copper level in flux ?

Hope this helps

Best regards


_____________________________________________________________
Jan Thuesen
Process Engineer
Chemitalic A/S
Egebjergvej 128
DK-8700 Horsens

Tlf.: ++45 76 28 70 00
Fax:++45 76 28 70 95

Mailto: [log in to unmask]

http://www.chemitalic.dk


-----Oprindelig meddelelse-----
Fra:    Julie Dixon [SMTP:[log in to unmask]]
Sendt:  7. oktober 1999 20:59
Til:    [log in to unmask]
Emne:   [TN] HASL-contaminated solder pot

TechNet,

We have sporadic problems with the copper level rising in our solder pot.
We
reduce the temp and dross each morning. Could you recommend a specific PM
program to keep our SnPb clean? We believe per the certicates of analyses
that
our supplier gives us good product. Any other reasons it might rise?

Thanks,
Green

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