We do solder paste inspection both from the machine and every 20th board we
measure paste height and record data on our Cyberoptics LSM.

We are looking at AOI but have not yet taken the leap relying on operator
inspection prior to reflow and 100% post reflow every 25th board.

We do 100% first article inspect and allow a max of 10 boards to be built
prior to release, we are experimenting with flying probe for constant
running jobs to minimize f1rst article time.


-----Original Message-----
From: Henry Rekers [mailto:[log in to unmask]]
Sent: Wednesday, September 18, 2002 2:19 PM
To: [log in to unmask]
Subject: [TN] Quality Metrics


Hello there,

I'm just trying to get a feeling of "state of the art"  in terms of quality
and rework in SMT.

What do you do?

Inspect?

AOI?

Rework?

What is your PPM defect?  Is that before or after rework?

Do you perform a full first article inspection?

Solder paste inpsection?

Any information would be greatly appreciated.

Thanks.

Henry J. Rekers
Power Measurement

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