I should have exclude voiding at the interface, as they are a different
story all together and I want to read the paper Dave referred to, as
it's rather difficult for me to understand why Pb-free solders "wouldn't
follow" the fracture mechanics rules.
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Sunday, February 24, 2008 7:12 PM
To: [log in to unmask]
Subject: Re: [TN] Shrink hole voids
That is no longer held to be true in the case of BGA voids, at least.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Friday, February 22, 2008 12:35 PM
To: [log in to unmask]
Subject: Re: [TN] Shrink hole voids
Hi David,
Think of rivets on a plane or ship. They are there to prevent a crack
from propagating. A hole (or void) will do the same trick. It does not
create a stress concentration (particularly in a ductile material like
solder) and therefore it can stop a crack ("swallowing" it). You can
take a look at the basics of Fracture Mechanics if you want to.
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Friday, February 22, 2008 1:29 PM
To: [log in to unmask]
Subject: [TN] Shrink hole voids
Hello TechNet Gurus,
I read an article that say that a shrink hole void (hot tear or sink
hole)
is not a crack, does not impact reliability, does not continue to grow
under thermo-mechanical stresses.
This seems to go against my common sense and would venture to say adds
to solder creep fatigue.
Would anyone like to comment on my comment and/or offer a link to where
I can find more information?
I am a poor country and your two cents goes a loooooong way.
As always, thank you in advance.
Thank you,
David Tremmel
Value Recovery
847 858-5540 - Cell
847 557-9574 - Office
847 557-9573 - Fax
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