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Date: | Fri, 20 Mar 2009 15:33:22 -0000 |
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Basic QFN/LGA criteria is covered in 610 and due to be expanded in the next
version of the standard. I am running a workshop at APEX in a weeks time if
that would be of interest, it includes inspection criteria for optical and
x-ray plus colour inspection charts included with the workshop
Check out the content and video clip introduction at:
http://www.ipcapexexpo.org/ProfDev.aspx
www.askbobwillis.co.uk/apex2009willis/bobwillis01.wmv
Many thanks
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
New Bob Willis "Printed Board Inspection & Quality Control Workshop" 24th
March www.ASKbobwillis.com/faworkshops.pdf
"Troubleshooting Your Assembly Yields Workshop" 25th March
www.ASKbobwillis.com/faworkshops.pdf
Book Bob's "Step by Step Failure Analysis Workshop" 22nd April
www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: 20 March 2009 11:00
To: [log in to unmask]
Subject: [TN] LGA acceptance
Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all it
says about Surface Mount Area Array is "for devices with solder balls that
collapse during reflow". Is there any IPC standard/specification define the
void on LGA? Thank you all and have a nice day!
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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