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March 2009

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Subject:
答复: [TN] Reflowing CBGA component (wit h high Sn balls) using Eutectic solder paste
From:
陈昆 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, 陈昆 <[log in to unmask]>
Date:
Mon, 2 Mar 2009 13:56:28 +0800
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Joe Macko

你好！ 

   回流焊接的熔融区的温度应适当地提高，建议实际最高温度在230℃±5℃。

 

 

 

陈昆

2009-3-2

 

-----邮件原件-----
发件人: TechNet [mailto:[log in to unmask]] 代表 Joe Macko
发送时间: 2009年2月28日 星期六 0:04
收件人: [log in to unmask]
主题: [TN] Reflowing CBGA component (with high Sn balls) using Eutectic solder paste

 

Hi All,

 

 

 

My question is related to the soldering of IBM PPC CBGAs type components

(that have Sn90Pb10 solder balls) using Sn63 paste onto ENIG finished

boards.  What are the "determining-factors" to improve the

wetting/diffusion of the eutectic solder paste into the high Sn solder

balls. The eutectic solder appears to wet well to the ENIG pads located

on the board but occasionally I see eutectic solder fillets that do not

always appear to fuse well with the high Sn content balls (if fuse is

the correct word?).  thx

 

 

 

 

 

Best Regards,

 

-Joe

 

 

 

 

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