Every board on the aircraft I saw passed the test!  What is the problem?
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri Jan 16 00:55:33 2009
Subject: [TN] Resin Recession

Dear all,

As per IPC 600G 3.1.9, resin recession after thermal stress is not considered as a defect for all classes of boards unless specified in the procurement document. We have a high reliability customer who requires 3 times thermal stress ( 3 cycles of solder dip for 10 secs at 288 deg C) to be done, with a maximum allowable resin recession of 10%. We find this to be extremely stiff . Can anybody provide us a feedback on this and any suggestions to achieve this.

Rgds,

Pradeep.M
Assistant General Manager
Micropack Limited
Plot#16, Jigani Industrial Area,
Anekal Taluk, Bangalore - 562 106
India
Tel : 91 80 27825223 / 27825224
Fax : 91 80 27825225
email : [log in to unmask]
visit us @ www.micro-pack.com



-------------------------------
Micropack Ltd, Bangalore, India

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------