Dear Technos,

 

Force was applied to an SMT passive part, just to see when and how it will break. It happened that it broke on the component side, rather than tearing the pad apart. And now we have a controversy, some say the soldering was not good, since the pad should always lift before ripping the component. Is it true, or the damage can occur just anywhere depending on so many factors, like the footprint, size of part (we're talking here of a rather thick part, 2.7 mm)?

 

See the part here http://www.littelfuse.com/searchresults.html?NttP=0451002.MRL&Ntt=0451002.MRL

 

So, again, is it the pads that should always rip under mechanical shock, or just anything in the joint could break?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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