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June 1999

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Subject:
From:
Kenneth Kirby <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Kenneth Kirby" <[log in to unmask]>
Date:
Wed, 16 Jun 1999 10:13:56 -0500
Content-Type:
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Neil check out your manual on the spray fluxer.  There is a fan pattern
nozzle avaliable for the fluxer that will do a better job of getting flux
into the through holes.

Ken Kirby



 (Embedded
 image moved   Neil Maloney <[log in to unmask]>
 to file:      06/16/99 09:59 AM
 pic11919.pcx)




To:   [log in to unmask]
cc:    (bcc: Kenneth Kirby/ElectrovertUS/Cookson)
Subject:  [TN] Spray fluxing...........How do you do it right




Greetings, Technet!

  I have more growing pains. Two weeks ago, we replaced our old stone-age
Hollis Wave solder machine with a new Electrovert. The old machine had an
air-stone/foam/bubble/"Lawrence Welk" type flux applicator. The new machine
has a nitrogen-pressurized/tank-type/reciprocating/"Al Capone" style flux
sprayer. (The Electrovert "Supa-Flux") Our problem is that we are not
getting good solder fillets on the top side of our assemblies. It is as if
the flux is not getting up into the holes of the boards. If the machine
operator manually squirts the top side of the boards with a spray bottle as
the go into the machine, we get good wetting and quality joints, likt we
used to get with the air stone.
    We are using a low-solid "no clean" flux (Alpha SLS 65, the same type
as
before with the old machine), we are spraying at maximum pressure (50 psi),
at minimum spray head traversing speed (11 ips). I believe that we are
putting as much flux onto the boards as the spray head can deliver.
   Is this a flux viscosity issue, or a spray head issue or something else?
What can I do short of handing everybody a squirt gun to flux the board
tops?

BTW- We decided to keep the new solder pot hot all the time. Thanks for all
your input on this matter.

Regards,

Neil Maloney
Service Technician
Contemporary Controls
http://www.ccontrol.com

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