Known by many names, such as Pin-In-Paste or Intrusive Reflow, it's a
proven process in wide use which we often use here. Though best suited
for simple, low mass parts such as headers, it can be applied to many
other connector/component applications. There are a few key points to
consider:

- Can the connector (or component) take reflow temps without 'meltdown'
or internal damage?
- Can you get the connector hot enough to fully reflow all the paste
without cooking the rest of the parts?
- Is there adequate area at the pads to overprint enough paste to meet
applicable IPC barrel fill requirements?
- If not, will you (or your customer) accept less than IPC based on
cross sections and pull tests to demonstrate electrical and physical
integrity of the joint?

There are a variety of resources available on the topic, here's a few to
get you started:
http://www.bobwillis.co.uk/pihsheet.doc
http://www.itm-smt.com/column15.html
http://www.amp.com/product/articles/dd66.html

In addition, search through the TechNet archives using 'Intrusive
Reflow' as the keyword, all sorts of stuff will pop up....

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Cathel, Paul [SMTP:[log in to unmask]]
> Sent: Thursday, June 03, 1999 7:28 AM
> To:   [log in to unmask]
> Subject:      [TN] Solder Paste in through hole
> Importance:   High
>
> Hi all,
>
> Does anyone have experience in soldering through hole connectors by
> applying
> solder paste with a stencil and reflowing in a forced convection
> reflow
> oven?
>
>
> Paul Cathel
>
> Senior Production Eng.
>
> Lockheed Martin
>
> Moorestown, NJ
>
> 609-722-3441
>
> [log in to unmask] <mailto:[log in to unmask]>
>
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