This just came in my email from SMT Net. I have not been able to link to the
article yet but the title and first paragraph sounds familiar.
Joe
_Fragility of Pb-free Solder Joints_
(http://www.smtnet.com/adsystem/redir.cfm?adid=831)
_Universal Instruments_
(http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=46383)
Credit/Source: Peter Borgesen, Surface Mount Laboratory, Universal
Instruments; and Donald W. Henderson, IBM Corporation
Recent investigations have revealed that Pb-free solder joints may be
fragile, prone to premature interfacial failure particularly under shock loading,
as initially formed or tend to become so under moderate thermal aging.
Depending on the solder pad surface finish, different mechanisms are clearly
involved, but none of the commonly used surface finishes appear to be consistently
immune to embrittlement processes. This is of obvious concern for products
facing relatively high operating temperatures for protracted times and/or
mechanical shock or strong vibrations in service...
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