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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 13 Nov 2001 08:17:01 -0000 |
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/Dear all,
I'm looking for some advice on the threshold limits for solder temperatures,
if for example, HMP solder is solidus/liquidus at say 296-301 deg C, what is
the highest temperature excursion it can see in service before the
properties of the soldered connection are affected?
I heard somewhere that as a rule of thumb you should allow around 40 deg C
below the melting point of the solder being used.
Any help/advice that you can give would be appreciated.
regards,
Pat Diamond
Weston Aerospace
Farnborough
UK
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