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July 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Thu, 6 Jul 2006 17:21:07 -0400
Content-Type:
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Cheryl

OSPs are typically applied to ENIG boards for handsets. George Milad would
be a good source for the details.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Cheryl Johnson" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, July 06, 2006 2:42 PM
Subject: [TN] osp over gold bond pads


> Does any one have any experience they care to share with OSP over
> electroplated gold bond pads (on FLEX)?
> It would save us 5 cents each if the gold pads didn't have to be masked
> before the OSP is applied...
> Thank you for your help!
> Sincerely,
>
> -----------------------------------
>
> Cheryl Johnson, C.I.D.+
>
> Manager
>
> ExcelStor US Office, Engineering Services
>
> Email: [log in to unmask]
>
> Tel: (303) 684-7291
>
> Fax: (303) 684-7268
>
> Mobile: (303) 809-5815
>
> -----------------------------------
>
>
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