Mr. Mike Gish

What article?

Roberto Torres
Matushita Avionics Systems Corp

                -----Original Message-----
                From:   Mike Gish [mailto:[log in to unmask]]
                Sent:   Wednesday, June 02, 1999 10:52 AM
                To:     [log in to unmask]
                Subject:        [DC] Silkscreen feature in between fine
pitch

                I just finished reading an article that described adding
silksreen
                features in between pads on fine pitch components to create
an
                additional solder barrier between pads.  Does anyone have
any experience
                doing this?  What is the minimum spacing that you found this
to be
                effective?  How hard was it to control the registration?
Was this
                screen print applied in addition to mask webbing? What was
the width and
                thickness of the screen print?  Ditron Manufacturing
speciallizes in PCB
                Assembly so you can imagine how helpful something this
simple could be.
                any information you can provide would greatly be
appreciated.

                What about using silkscreen barriers (Circles) around BGA
pads?

                I haven't used this method in actual practice but appreciate
the theory

                Talks in advance

                Mike Gish
                Sr. PCB Designer
                Ditron Manufacturing, Inc.


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