Does anyone have any information (or sources of information) on
wirebonding on solder contamination.  We are using 5 mil aluminum wire
bonded to gold plated surfaces.  We sometimes run into small (.002" -
.004") amounts of solder contamination on our wirebond surfaces, and our
concern is the instances when these are missed at inspection.  Our
wirebond feet are typically .008" x .013", therefore a small area of
solder could be underneath the wirebond foot and not be visually
detected.  Is there any data or experience that would indicate whether
or not this is a problem, and if it is, how big of a problem?  I would
appreciate any info I can get on this.
Thank you,
Mark Miller

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