Research at Boeing refutes the 75% fill requirement. I have a copy of a document in
which they promote a 50% fill. I understand this position is being discussed for
IPC-A-610C, which has not been released.
Even so, the difficult question is why did the solder process only produce partial
fill. If there is good evidence of wetting on the lead and barrel then I would trust
the joint. If not . . .
By the way vias do not have to have any fill when judged by A-610 standards.

[log in to unmask] wrote:

> Hi Steve and all
> The requirements that say a hole does not need to be filled is a fact
> HOWEVER if it is filled it must be at least 75% filled.  This value is
> a result of a great deal of data and was recently re-affirmed by 001.
>
> The reliability of a hole is the best when either completely (>75%)filled
> or completely empty.  Fill that is inbetween has proven to degrade
> reliability.
>
> Susan Mansilla
> Robisan Lab
>
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