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June 2005

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Subject:
From:
Le Thanh Tung <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Le Thanh Tung <[log in to unmask]>
Date:
Sat, 25 Jun 2005 15:29:36 +0700
Content-Type:
text/plain
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text/plain (56 lines)
Azman,
How is fine pitch ?
How about your stencil design ?
Notrogen setting at your comp. ?
What is your printer ? Solder paste maker ? Viscosity in present ?....
I maybe help you if you provide us items mentioned above in detail.
Best regards.

----- Original Message -----
From: "azman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, June 25, 2005 12:25 PM
Subject: [TN] Lead free solder paste


> Hi all,
>
> Recently I had a problem with printing the lead free solder paste, almost
> every board has bridging especially on the fine pitch locations. Anyway
> this problem never happens when we use leaded solder paste. So I would
like
> to ask if there are any special controls such as environment, viscosity,
> stencil design and printer parameters in order to achieve good printing
for
> lead free solder paste.
>
>
> Best regards
> Azman
> Process Eng.
>
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