I also want to have this report .
Thanks.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
Sent: Thursday, May 24, 2007 7:33 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
One more copy, please.
Wenger, George M. a écrit :
> Yes I would like to get a copy of the report that you r Ingemar,
>
> Yes I would like to get a copy of the report that you received from your colleague from Beijing. It sounds like it would be interesting.
>
> Regards,
> George
> George M. Wenger
> Andrew Corporation Wireless Network Solutions Senior Principal FMA /
> Reliability Engineer 40 Technology Drive, Warren, NJ 07059
> (908) 546-4531 [Office] (732) 309-8964 [Cell] -----Original
> Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Frederick Miller
> Sent: Thursday, May 24, 2007 7:55 AM
> To: [log in to unmask]
> Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
>
> Add me to the list.
> Fred
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
> Sent: Wednesday, May 23, 2007 4:17 PM
> To: [log in to unmask]
> Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
>
>
> I would like to view this presentation/report.
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
> Sent: Wednesday, May 23, 2007 3:16 PM
> To: [log in to unmask]
> Subject: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
>
> Richard, George, Werner etc chief gnus,
>
> Want a very advanced article on the theme SAC, IMC, Phosphorous rich
> Ni, diffusion rate, solidifying, wetting, ENIG, crystallographic
> pictures, SEM pictures, etched cross sections, X-ray investigations,
> microprobing...more than 30 pages?
>
> I made a consulting job (metallurgists, need assistance) and had a two
> hours presentation of my job. Both companies were satisfied, much
> thanks to advice from you, but also thanks to my collegue, who is from Beijing.
> He gave me a report that lifted my eyes. I've never seen SAC/ENIG
> cross section presentations like that. Not even from China Lake. Can
> send offline if you are not too many. Please, be aware this is not a
> popularised kind of presentation, but at a advanced metallographic
> level. You may have it already...don't know, but the report is fresh.
>
> Inge
>
> -----Ursprungligt meddelande-----
> Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
> Skickat: den 23 maj 2007 20:44
> Till: [log in to unmask]
> Ämne: Re: [TN] SV: [TN] Definition of Eutectic Solder
>
> Hi Richard,
> If you try to solder at or just above the Solidus temperature, you
> need a long time to get wetting [it takes thermal energy to dissolve
> the base metal into Sn], and you may not get good wetting art all.
> That is why I recommend
> Liquidus+20C for reflow soldering to Cu, and Liquidus+35C for reflow
> soldering to
> Ni. This time above 183 recommendation of 60 to 90 sec is wrong.
>
>
>
> Werner
>
>
>
> **************************************
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