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Subject:	Re: SV: [TN] Tacking corners of BGAs
From:	"Hogg, Blair K." <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Hogg, Blair K.
Date:	Tue, 17 Apr 2007 14:28:34 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

Maybe the BGA manufacturers should add a standoff on the underside of the device to prevent the balls from collapsing too much?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, April 17, 2007 1:46 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] Tacking corners of BGAs

In a message dated 4/17/07 13:39:24, [log in to unmask] writes:
> 
> Well then,
>  Work as distances. Why didn't you say that from the beginning. Like 
> we use
> sometimes: we remove some corner balls and replace with somewhat 
> higher temperature.  I understand now. Thanks.
> 
Hi Inge, given that we no longer have any "... somewhat higher temperature balls" in this crazy lead-free world of ours, this is a pretty neat solution.




Werner


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