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February 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 28 Feb 2008 11:09:56 -0600
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Yup. Yup. Yup. Too many potential issues to even try to cover. You got
it, Joyce. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Thursday, February 28, 2008 10:41 AM
To: [log in to unmask]
Subject: Re: [TN] Lead free questions

Fatigue, thermal shock, service life, etc..jk
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Feb 28 11:15:38 2008
Subject: Re: [TN] Lead free questions

Hi 'K,'
There is no real down-side to the use of the 'lead-free process' for
leaded 
products. You will get somewhat thicker IMC layers, but that has no
solder 
joint reliability consequences (excepting component and PCB issues),
unless you 
have a large number of excursions to the soldering temperature.
As you say "We are excluded for reasons....," but than on the other hand
so 
should everybody else as well.

Werner



**************
Ideas to please picky eaters. Watch video on AOL Living.
      
(http://living.aol.com/video/how-to-please-your-picky-eater/rachel-campo
s-duffy/
2050827?NCID=aolcmp00300000002598)

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