Hmmmmm......
Nano-particle technology has tremendous promise in all sorts of areas
including solder replacement. In solder replacement most effort so far has
centred on high temperature alloy replacement for die attach apps, where a
high service temperature, low cost process is needed. Just about everything
has been tried in this zone, including doing away with all material problems
by not having any, but I think it would be fair to say that no outright
winning technology has so far emerged.
I'm not sure that I would place PCB soldering ahead of die attach. For PCB
soldering there are simpler alternate alloy processes. Die attach is proving
more difficult.
Beneath the headlines the actual hard information seems scant, but I have to
say it doesn't seem qualitatively different from hundreds of other similar
nano announcements - including copper based technology - I have read in the
last couple of years.
They all announce potential benefits based on some preliminary study, go on
to say actual delivery between 2 and 5 years, just a few things to sort out
(bond strength is admitted for this). The ones that have arrived so far
haven't completely delivered, most having process issues such as high
pressures and/or long process times and/or bond quality
The significant difference if any on this announcement is that it is not a
pleas for cash. It does have some relatively serious funding in place
already, so perhaps I more serious. So watch this space, but I suggest not
to hold your breath whilst doing so.
Best Wishes
Mike-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Sunday, April 07, 2013 5:40 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi
Harvey,
What about rework?
Bev
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey
Sent: Saturday, April 06, 2013 9:16 PM
To: [log in to unmask]
Subject: [TN] copper nanosolder--fyi
Biltmore Santa Clara for dinner (or non-dinner)
June 12, 2013.
Dr. Zinn's bio and abstract are at the end.
Lockheed's nano-copper solder is an answer to the lead-free
solder
fiasco.
Remember "the non-solution to the non-problem",
that
is, until we get rid of most solder altogether, most solder
paste,
anyhow.
Speaker:
Alfred Zinn, Lockheed Martin Space
System Company ATC, Senior Scientist
Abstract:
NanoCopper Materials Platform for Electronic
Packaging and Printed Electronics with 200 °C Processing
Temperature
The Advanced Technology Center of the Lockheed Martin
Corporation has developed a nanocopper-based material that
can
be fused to bulk copper around 200 °C taking advantage of
the
rapidly decreasing fusion temperature with decreasing
particle
size at the nanoscale. The nanocopper material has the
potential to replace tin-based solder to eliminate whisker
growth and mechanical reliability concerns encountered
with
current lead-free solder. Fully optimized, the fused
copper is
expected to exhibit 10-15x electrical and thermal
conductivity
improvements over tin-based materials currently in use.
The
materials platform is enabled by our scalable Cu
nanoparticle
fabrication process employing a low cost solution-phase
chemical reduction approach. A proprietary mixture of
surfactants controls particle size and size distribution
as
well as stabilizing the particles preventing particle
growth
and oxidation, which would otherwise degrade its activity.
We
have demonstrated assembly of fully functional LED test
boards
using a paste formulated with nanocopper that exhibits a
consistency very similar to standard tin-based solder
paste.
To date, we have demonstrated 26-pin through-hole
connector
assembly and a variety of surface mount components. We
demonstrated feasibility of drop-in solder replacement
using
standard stencil and pick & place packaging equipment as
well as demonstrated feasibility of using the material for
printed electronics applications.
Dr. Zinn
received his Doctor of Science degree in Chemistry in 1990
from the Philipps University, Marburg, Germany. Following
completion of his graduate studies, Dr. Zinn spent five
years
at UCLA as a lecturer and conducting postdoctoral research
on
low-temperature CVD for interconnect, diffusion, and
migration
barrier deposition, as well as magnetic nanomaterials
design
and synthesis. In 2004, he joined Lockheed Martin Space
Systems Company Advanced technology Center in Palo Alto,
CA
developing high-temperature materials systems,
nanostructured
functional materials (electrical, thermal,
thermoelectric),
modeling quantum/superlattice structures and devices, high
performance energy conversion devices (solar, high & low
quality heat conversion). He holds seven patents in
materials,
structures and processing, two THz technology patents,
with
ten additional patents pending (multiple international
filings) as well as four trade secrets. He has authored or
co-authored over 20 archival journal publications,
including
book chapters in "The Chemistry of Metal CVD" as well as
the
"Encyclopedia of Inorganic
Chemistry.
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