Scott,
If my memory serves me right, I remember that someone, NEC I think, had
patented the process of gluing surface mount parts on the bottom of PCB's
prior to wave soldering.
I believe the discussion was right on this very forum.
I think NEC received a number of patents for what was perceived as "normal"
assembly practices.
I don't think anything has been awarded in terms of penalties for patent
violations.
Anyone else remember it that way?
Bill Kasprzak
Moog Inc., Systems Group, Process Engineer
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Scott Nimon
Sent: Friday, January 07, 2005 2:09 PM
To: [log in to unmask]
Subject: [TN] Patent No.: US6,617,529 B2
DC members,
I have encountered a patent which any through-hole land patterns with an
annular ring of >0.4mm and used for lead-free soldering is in violation
of. We have used 0.4mm as our standard annular ring for all
through-hole devices with hole sizes greater than 1.6mm for years. A
link to the patent is provided below. Are there any IPC documents I can
use to invalidate this patent? Any suggestions or comments will be
welcomed.
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL
&p=1&u=/netahtml/srchnum.htm&r=1&f=G&l=50&s1=6,617,529.WKU.&OS=PN/6,617,
529&RS=PN/6,617,529
Scott Nimon
Yazaki North America
6801 Haggerty Road
Mail Stop: 2229E
Canton, MI 48187
Phone: 734-983-2630
Fax: 734-983-2631
[log in to unmask]
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