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June 2010

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From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Fri, 11 Jun 2010 12:40:59 -0700
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A wise comment was obviously addressed to me, but the SiC in the rough
is most definitely a reference to Graham at the GOLF course.

Dewey

 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Friday, June 11, 2010 12:06 PM
To: TechNet E-Mail Forum; Whittaker, Dewey (EHCOE)
Subject: Re: [TN] Weird formation of voids

 


A wise comment from a SiC in the rough.................. 

Doug Pauls 



"Whittaker, Dewey (EHCOE)" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]> 

06/11/2010 01:52 PM 

Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>

To

[log in to unmask] 

cc

 

Subject

Re: [TN] Weird formation of voids

 

 

 




It's always good to get a view from a cross-section of our Industry,
regardless of how well polished it was or not.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of stephen gregory
Sent: Friday, June 11, 2010 8:21 AM
To: [log in to unmask]
Subject: Re: [TN] Weird formation of voids

Hi Bev!
 
Got your picture today, and have it posted now:
 
http://stevezeva.homestead.com/Bevs_Ball.jpg
 
Almost looks like little pieces of dross. I wonder if something is going
on with the solder paste? Or leaded reflow profile with a lead-free BGA?
 
Steve

--- On Wed, 6/9/10, Bev Christian <[log in to unmask]> wrote:


From: Bev Christian <[log in to unmask]>
Subject: [TN] Weird formation of voids
To: [log in to unmask]
Date: Wednesday, June 9, 2010, 9:51 AM


TechNetters,
I am sending a picture to Steve to post.  I have labs in three
locations.  One of them has seen weird voids in cross-sections of BGAs
while the other two locations have not.  For the lab that has seen them,
the cross-sections were prepared by different people on different days
for different products, using the same equipment. The voids are not in
all balls cross-sectioned but may be only in one of two of the balls in
a row of multiple solder joints examined.

Have you seen anything like this?  Do you know the root cause?

Vlad,
You know what is going on, so please don't respond.

Bev


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