The best way to improve surface to hole plating is through the following:
1. Lower metal content and increase acid content to improve conductivity
2. Reduce amps and increase plating time (severely impacts production)
3. Improve solution agitation through the holes
4. Optimize and balance plating films to improve plating distribution from
side to side
5. Some single component brightener systems are effective but most people
trying to obtain 1:1 on 6:1 aspect ratio boards will end up using multi
component brightener system. Call direct if you would like to discuss
further
-----Original Message-----
From: Jason Zhao <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, July 01, 1998 10:12 AM
Subject: [TN] Surface to hole ratio of copper plating


>Hello, everyone.
>I am doing a project to improve our capability and overcome the
>overplating issues in copper plating. the vendor suggested us to reduce
>the number of anodes to lower the surface to
>hole ratio. Would that help? What are the other factors that affect the
>surface to hole ratio? we are using electrochemicals PC-667 acid
>copper.
>Thank you in advance.
>
>Ja
>
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