Hi TN,
From an assembly perspective, what is the maximum surface roughness tolerable for via in pad 0.5mm pitch BGA, particularly
larger parts with pin counts >=80?
Same topic, but from a fabrication viewpoint:- What is achievable using either 1 stage plated shut process or a 2 step process
using filled/levelled microvia which is then plated over?
Best Regards
David Greig
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GigaDyne Ltd
http://www.gigadyne.co.uk <http://www.gigadyne.co.uk/> <http://www.gigadyne.co.uk/>
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