Hi,
What is the common practice concerning blind-microvias located on BGA pads:
a) open ? ( 2-3 mills diameter, 2 mills deep)
b) filled with what ( fill materials,LPI solder mask)?
c) filled with electroplated copper ?
Pls advice
Edward Szpruch
Eltek , Manager of Process Engineering
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel ++972 3 9395050 , Fax ++972 3 9309581
e-mail [log in to unmask]
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