Dear Technet,
I have a customer who is reporting bridging on the solder side of the board
after wave soldering.  I have seen the boards, and they look quite messy,
with solder sticking to the mask as well as between component leads and
pads.  The mask itself is adhering nicely.  The mask is PC501 from Haven,
with C101 hardener.  This was recently discontinued by MacDermid and picked
up by Haven.  The flux is no clean, ENFLUX NCF-8660, and is under pressure
with nitrogen.  The wave itself is at 500 degrees F, with preheats set to
get the board to 210 to 220 degrees F when it hits the wave.  The same
design board with LPI ran fine, so I do not suspect a problem in another
area of the process.

No other customers are reporting this problem, and I am at a loss as to
where to investigate further. The customer is not happy, and wants a
resolution today!  If anyone has any insights, please let me know.

Thanks,
Elizabeth Falk
Process Engineer, Beaverbrook Circuits

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************