Yes I would like to get a copy of the report that you r
Ingemar,
Yes I would like to get a copy of the report that you received from your colleague from Beijing. It sounds like it would be interesting.
Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Frederick Miller
Sent: Thursday, May 24, 2007 7:55 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
Add me to the list.
Fred
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Wednesday, May 23, 2007 4:17 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
I would like to view this presentation/report.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Wednesday, May 23, 2007 3:16 PM
To: [log in to unmask]
Subject: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
Richard, George, Werner etc chief gnus,
Want a very advanced article on the theme SAC, IMC, Phosphorous rich Ni,
diffusion rate, solidifying, wetting, ENIG, crystallographic pictures,
SEM pictures, etched cross sections, X-ray investigations,
microprobing...more than 30 pages?
I made a consulting job (metallurgists, need assistance) and had a two
hours presentation of my job. Both companies were satisfied, much thanks
to advice from you, but also thanks to my collegue, who is from Beijing.
He gave me a report that lifted my eyes. I've never seen SAC/ENIG cross
section presentations like that. Not even from China Lake. Can send
offline if you are not too many. Please, be aware this is not a
popularised kind of presentation, but at a advanced metallographic
level. You may have it already...don't know, but the report is fresh.
Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
Skickat: den 23 maj 2007 20:44
Till: [log in to unmask]
Ämne: Re: [TN] SV: [TN] Definition of Eutectic Solder
Hi Richard,
If you try to solder at or just above the Solidus temperature, you need
a
long time to get wetting [it takes thermal energy to dissolve the base
metal into
Sn], and you may not get good wetting art all. That is why I recommend
Liquidus+20C for reflow soldering to Cu, and Liquidus+35C for reflow
soldering to
Ni. This time above 183 recommendation of 60 to 90 sec is wrong.
Werner
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