In my experience, what a PCB fabricator would consider a sliver would be
the strip of soldermask material between RECTANGULAR pads being less than a
minimum width.
We got a "DFM report" for a board where minimum distance between ROUND vias
is being reported as slivers.Has anyone ever heard of problems with minimum
mask material between round, unsoldered vias?
I can't imagine any real-world problems that could cause, but I have an
open mind...