I'm looking for references or written guides and any helpful recomendations
to identify parameters to investigate and construct a robust and meaningful
solder paste stencil printing process validation.  After checking through
the archives, I found a posting which pointed to an FDA document.  Alas, the
document no longer exists.  I'm looking to find what observations and
measurments other than the obvious accuracy, volume, height and paste age.

George Carroll
Process Engineer, Siemens Energy & Automation
P.O. Box 1255
3000 Bill Garland Road
Johnson City, TN 37605
(423) 461-2948
[log in to unmask]

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