Hello Technetters,

I have a family of boards that to achieve 100% hole fill (I'm building to
IPC-A-610C class 2 - yeah, I know 100% isn't required), I need to preheat
the topside of the board to approximately 310F at about 1.75 ft/min (maybe
a 6-7 second dwell).  I usually follow the 180-220F rule-of-thumb, so I'm
asking: What are the potential or real problems?  Also, the flux is OA.

The family of boards are .050-.070" made out of either FR4, GE TEK, or
NELCO 4000-13.  They are also waved in a selective soldering pallet with an
aluminum plate on the topside over 90% of the components to hold them in
place per a design specification.

Will I damage the board or components (with immediate noticeable failures
or latent field failures)?  Or is the 180-220F guideline more from the old
WS6536/Mil-Std-2000 days and todays fluxes, boards, and components can
handle the temperatures?

Thanks in advance for the help,

Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
Mail Stop NR500 1-1
North Reading, MA 01864
Tel: 978-370-1726
Fax: 734-661-5352
Pager: 888-561-6485

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