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October 1999

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Subject:
Re: Solder float thermal shocks.
From:
Rob <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Oct 1999 20:42:36 -0700
Content-Type:
text/plain
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text/plain (54 lines) 
Susan,
I always like the term thermal excursion.

Best Regards...Rob Durante
-----Original Message-----
From: [log in to unmask] <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Tuesday, October 05, 1999 5:59 AM
Subject: Re: [TN] Solder float thermal shocks.


>Hi Rich
>The companies I have seen doing multiple thermal stresses (sure wish
>we could get rid of that "shock" word) float the same side down each
>time.
>
>When we are requested to do multiple stresses, we also have the same
>side down each time.
>
>I have seen nothing in writing that instructs to do so.
>
>Susan Mansilla
>Robisan Lab
>
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