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April 2008

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Subject:
From:
David Reed <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Reed <[log in to unmask]>
Date:
Wed, 30 Apr 2008 09:29:57 -0500
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text/plain
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Recently a customer asked the following question.
Here is his question.
 
 I do have a question of interpretation for you regarding "gold removal".  
In section 3.9.3 it states that ".....95% of the surface to be solder  ....." 
needs to have gold removed.  Failing to achieve the 95% is considered a class 
3 defect.   

We are having boards with PIH gold plated leads rejected for not meeting this 
requirement. 

Part of the problem is making the determination as to where and how the 95% 
is measured. 

Can you clarify for us exactly where the 95% is measured on the lead.
 
Before I reply to this engineer I thought to see if you had any input.


Thanks,
Dave

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