I would like to view this presentation/report.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Wednesday, May 23, 2007 3:16 PM
To: [log in to unmask]
Subject: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder
Richard, George, Werner etc chief gnus,
Want a very advanced article on the theme SAC, IMC, Phosphorous rich Ni,
diffusion rate, solidifying, wetting, ENIG, crystallographic pictures,
SEM pictures, etched cross sections, X-ray investigations,
microprobing...more than 30 pages?
I made a consulting job (metallurgists, need assistance) and had a two
hours presentation of my job. Both companies were satisfied, much thanks
to advice from you, but also thanks to my collegue, who is from Beijing.
He gave me a report that lifted my eyes. I've never seen SAC/ENIG cross
section presentations like that. Not even from China Lake. Can send
offline if you are not too many. Please, be aware this is not a
popularised kind of presentation, but at a advanced metallographic
level. You may have it already...don't know, but the report is fresh.
Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
Skickat: den 23 maj 2007 20:44
Till: [log in to unmask]
Ämne: Re: [TN] SV: [TN] Definition of Eutectic Solder
Hi Richard,
If you try to solder at or just above the Solidus temperature, you need
a
long time to get wetting [it takes thermal energy to dissolve the base
metal into
Sn], and you may not get good wetting art all. That is why I recommend
Liquidus+20C for reflow soldering to Cu, and Liquidus+35C for reflow
soldering to
Ni. This time above 183 recommendation of 60 to 90 sec is wrong.
Werner
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