I'm sure that Dave Hillman or Werner are more qualified but I noticed no
answers to your post. I'll take a stab at it and perhaps stir the pot.
A disturbed connection was moved during the transition from liquid to
solid. Movement during this time changes the grain structure of the
connection in unpredictable and undesirable ways. Cracking may begin
earlier in the life of the connection compared to an undisturbed solder
joint.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of farnam_jack
> Sent: Tuesday, February 11, 2003 2:30 PM
> To: [log in to unmask]
> Subject: [TN]
>
>
> How is solder joint reliability effected over time in the
> case of disturbed solder (12.4.6)?
>
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