LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

July 1998

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET July 1998

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	White ID Materail
From:	Der-jin Woan <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 16 Jul 1998 10:00:41 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

Werner Engelmaier wrote:
>
> Hi Karl,
> In general you are correct, however, solder, accept for low temperatures
> and/or high strain rates, neither of which occurs in typical applications to
> an extent to be significant, does not experience significant elastic strains
> (be careful however, because the PCB, the component, and the leads can store
> elastic deformations that covert into plastic deformation in the solder given
> enough time for completion of the creep process). Thus, considering plastic
> deformations only is appropriate for both use conditions and proper
> accelerated testing (IPC-SM-785). However, the equation given by Pratap should
> be considered only a very coarse acceleration transform; the exponent is
> temperature and dwell time dependent because of the temperature- and time-
> dependence of the solder creep dominant in the plastic strain formation.
>
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting

Hi, Everyone,

I'm trying to evaluate different white ID materials to use on top of
soldermasks such as DSR, Vacrel, etc. It has to be screenable and,
preferably, thermal curable (will look into UV curable too) material.

If you have experience (good or bad) on current commercially available
materials and could share either through posting here or e-mail, it'll
be greatly appreciated.

Der-jin Woan

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2

LISTSERV.IPC.ORG