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June 1999

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Subject:
Solderpaste height
From:
CharlesC <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Jun 1999 08:57:06 -0500
Content-Type:
text/plain
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text/plain (4 lines) 
First, thanks for the informatioin on silver immersion. My next question will
probably be of interest to a larger audience. We are starting to implement SPC
on our SMT process.

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