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October 1999

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Subject:
Re: Soldering gold terminations (component manufacturers ?)
From:
Carey Pico <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Oct 1999 21:11:02 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines) 
What now??? Palladium??  Not as robust as Ni for
metallization reliability, but is closer to nobility (ahhh, the kings).  Any
Q's?  And
what is TI's Pd story.  I'm not in on it.  Is this only for electroless
plating?
Carey
-----Original Message-----
From: Paul Klasek <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, October 13, 1999 7:36 PM
Subject: Re: [TN] Soldering gold terminations (component manufacturers ?)


>Any trends to gear up for (like's Ti's Palladium, etc.) ?
>
>Paul Klasek
>ResMed
>
>-----Original Message-----

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