Hi Jana,
>I saw your comment regarding thermal stress of plated through holes on
>tech-net.  I'm wondering if you can tell me if there is any recent
>literature regarding reliability testing of vias, such as AATC, thermal
>or bias testing?  Does IPC have any published studies on this?

Yes, IPC-TR-486, Report On Round Robin Study To Correlate Interconnect Stress
Test (IST) With Thermal Stress/Microsectioning Evaluations For Detecting The
Presence Of Inner-Layer
Separations.
Werner Engelmaier

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