A futurologist (yes there is such a job) once remarked that the future
is always oversold and underimagined.
Advances in microelectronic packaging technology, things like stacked
die and chip scale packaging, will mean that you'll see more I/O's on a
single device with smaller pitches. Perhaps that will mean fewer
components on any one PWB but with finer detail with fewer products
being amenable to hand assembly or rework. Things like buried capacitors
may become more common but I suspect they will prove to be more trouble
than they're worth in most instances.
I suspect that automation will become more sophisticated and less
expensive but that will be automation of existing processes and not new
ones.
I don't see any revolutionary changes on the horizon but suspect someone
will prove me wrong in the next post on this thread.
If you're doing high rel stuff then have a look at what's inside a
mobile phone today and expect to see adaptations of that appearing in
avionics etc. in a few years time.
Regards,
On 17/01/2012 14:53, Mike Buetow wrote:
> As a wise man told me, Never underestimate the tenacity of incumbent
> technologies.
>
>
> Best,
> Mike
>
> Mike Buetow
> PCD&F/Circuits Assembly
> w/m 617-327-4702
> Twitter: @mikebuetow
>
> Join our new LinkedIn Group: EMS -- Electronics Manufacturing Services
>
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>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
> Sent: Tuesday, January 17, 2012 9:49 AM
> To: [log in to unmask]
> Subject: [TN] What is the future of electronics assembly?
>
> Dear Technos,
>
>
>
> I can't help but thinking about the future of our trade. Will electronics
> assembly, the way we are doing it now, still be around 5 years from now?
>
>
>
> I mean, with printed electronics and nano materials, a manufacturing plant
> equipped with solder paste printers, insertion machines and wave, will
> still be in use? Even Joe Fjelstad's Occam process requires completely
> different machineries.
>
>
>
> As you might have guessed, the bottom line is: what technologies and
> equipment should we start looking at NOW, so that we still be able to make
> ends meet by the end of the decade?
>
>
>
> Thanks,
>
>
>
> Ioan Tempea, ing.
> Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
> T | 450.967.7100 ext.244
> E | [log in to unmask]<mailto:[log in to unmask]>
> W | www.digico.cc<http://www.digico.cc/>
>
>
> N'imprimer que si nécessaire - Print only if you must
>
>
>
>
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--
Eric Christison
Consumer& Micro group
Imaging Division
STMicroelectronics (R&D) Ltd
33 Pinkhill
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United Kingdom
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