Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 8 Oct 1999 21:01:17 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Green,
Mike Barmuta gave you a very good reply. I just wanted to add that your plating
time depends on the actual aspect ratio of the panels you are plating. The
higher the aspect ratio -- the lower the current density you will have to apply
to get a minimum of 1 mil copper deposit in the center of the high aspect ratio
holes without grossly overplating isolated pads/traces on the surface.
(Actually, a thicker panel at equal aspect ratio is more difficult to plate then
a thinner one.) I'm not sure what you call "moderate difficulty", but I'd say
you should be able to plate up to 4:1 aspect ratio panels at 30 ASF in about
45-50 min. depending on your minimum copper thickness requirements.
Eric Yakobson
Alpha PC Fab
Julie Dixon <[log in to unmask]> on 10/07/99 12:12:32 PM
To: [log in to unmask]
cc: (bcc: Eric Yakobson/AlphaPCFabUS/Cookson)
Subject: [TN] plating times for pcb's
Dear Technet,
For a small shop without automation or ppr, what is a standard time
acceptable to
plate moderate to low difficulty double- sided boards to 1 mil with a
standard acid copper plating solution?
Our vendor can offer us a different brightner system, etc., I was just
looking for a
norm. We can make adjustments to speed our cycles, but we give up even
distribution.
Thanks,
Green
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text
in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|