Does anyone have an update on the work of this committee?  Where can I find
the draft of the document (I searched both D33 and Via Protection and
couldn't find it)?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Wednesday, September 15, 2004 6:03 AM
To: [log in to unmask]
Subject: Re: [TN] Question about via masking on BGA pattern...

Hi Steve
We spend a lot of time on failure analysis of these little cups full of acid
and the resulting etching out of hole wall copper.

IPC has a committee now almost ready for a round robin of the various types
of tenting/capping/plugging etc methods.  It is D33-d Via Protection.  You
can
go to the IPC website and look at the draft of the document we are working
on
at this time.

If you go to 2221A para 4.5.1 it tells you the vias have to be tented on
both
sides.

Susan Mansilla
Robisan Lab

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