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May 1998

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Subject:
TN Electrical Conductive expoxy use of
From:
Paul Allen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 May 1998 11:28:50 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
Dear Tech Netters,
I have an application requiring the use of AIT electrical conductive
expoxy, ME 8452 does anyone have an experience in controlling thickness
of bond lines.Currently with our application bonding two PCB's together,
squeeze out is proving hard to control. Our customer wants zero. Any
ideas.
Paul Allan.

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