Werner, none of the work is useless. Any work always ads something to the knowledge. Regarding the "creep -fatigue" (model I assume), then it's just an analytical model, not the MICROMECHANISM. As far as I know, any process does have it's own activation energy. So, I don't think that failure of solder joints is exceptional.
I completely agree with what Inge just said and can understand his "frustration". As long as the exact micromechanism isn't established (with the appropriate model), we wouldn't be able to predict the reliability.
Regards,
Vladimir
Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
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-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, November 16, 2005 11:43 AM
To: Vladimir Igoshev; [log in to unmask]; [log in to unmask]
Subject: Re: [LF] Reliability prediction of LF soldering
Hi Vladimir,
You assume that solder creep-fatigue follows an Arrhenius model with some activation energy--it does not. Are you telling me, that because the micromechanism of fatigue is not described in this fashion, all the work that people have been doing in the whole field of fatigue is useless?
Werner
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