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October 1999

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Subject:
From:
Jon Moore <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Oct 1999 10:43:32 EDT
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text/plain
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In a message dated 10/6/99 8:04:50 AM US Eastern Standard Time,
[log in to unmask] writes:
>>SNIP<<...
> In addition to what you are looking
>  for, we are looking for a fast cure solder masking that is water
>  soluble.  (Continuous flow is difficult to do if you must wait ten
>  minutes for the masking to cure.)
          ...>>SNIP<<

Ryan,
      Here is how I dealt with that issue, but it really only works if you
have bottom side SMD's going through your wave process.  I put the temp
solder mask on right after placing the bottom side SMD's, but before the cure
oven for the SM adhesive.  That way the oven cured the adhesive and dried the
mask thoroughly before the wave operation.

Jon Moore

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