Hello TechNeters,

The PCB for lead free soldering  with the Immersion tin  technology has allegedly  around 1%  of Ag in this Tin plating  to alleviate the whickers growth potential.

Would anybody know and tell us if this 1%  of Ag is the correct proportion for  prevention  of the whiskers growth  and if not what is the recommendation?
Thank you for info beforehand.


        Vit Sklenar  .
        Robert Bosch (Australia) Pty.Ltd
      RBAU-AE/MFE3
        Locked Bag 66;Clayton South, VIC 3169
        AUSTRALIA
        Tel: +61 3 9541-7734
        Fax: +61 3 9541-3909
        Mob: +61 434 079 373
        [log in to unmask]

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